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Automatic optical inspection

Hardcore blessing, operate with ease

Introduction to Precision Vision System (PVS)

The Precision Vision Systems is an Energy independent research and development, based on automatic optical inspection technology, for the field of chip appearance inspection, it integrates hardware control, visual recognition, and statistical analysis functions. It uses image analysis, logical operations, and fusion of rigid body dynamics. More than a variety of advanced detection algorithms, with generalization and fitting capabilities, can be used with the image acquisition, analysis, and quantification system for the sorting function.

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Features of Precision Vision System

Hardcore blessing, operate with ease

ENG

High precision

ENG

intelligence

ENG

visualization

ENG

modularity

ENG

convenience

ENG

2D detection

Precision Vision System Algorithm

More than ten kinds of advanced analysis and calculation to achieve the best detection ability.

The Precision Vision System can deal with diversified chip defect detection, completely abandoning the "single calculation method". For different detection fields and different detection types, different algorithms are used to ensure the best detection accuracy.

ENG

Image comparison

ENG

image stitching

ENG

image denoising

ENG

image segmentation

ENG

image grayscale morphology

ENG

image calibration

ENG

data statistics

ENG

geometric algorithms

ENG

rigid body dynamics

ENG

high-precision matching

Precision Vision System Process

Generalization ability based on Occam's Razor Law—Simplify the complex and comprehend by analogy

Image acquisition

image processing

defect extraction

shape fitting

result feedback

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AOI automatic optical defect detection

More flexible · smarter · more efficient

Detection case demo

ENG

Chip

NG-insp Weld region failed

len:=28.16

Scuffing

NG-insp Weld region failed

len:=107.061

ENG
ENG

Smudginess

NG-insp Weld region failed

len:=8.8

Optical channel

Fracture

NG-insp Weld region failed

len:=3.96

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Optical channel

Fracture

NG-insp Weld region failed

len:=3.08

Abnormal size

image size NG

ChipWidth:=234.52

Chiplength:=187.88

ModelChipWidth:=232.76

ModelChiplength:=188.32

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ENG

Chip

NG-insp Weld region failed

len:=28.16

Scuffing

NG-insp Weld region failed

len:=107.061

ENG
ENG

Smudginess

NG-insp Weld region failed

len:=8.8

Optical channel

Fracture

NG-insp Weld region failed

len:=3.96

企业优势
企业优势

Optical channel

Fracture

NG-insp Weld region failed

len:=3.08

Abnormal size

image size NG

ChipWidth:=234.52

Chiplength:=187.88

ModelChipWidth:=232.76

ModelChiplength:=188.32

企业优势
ENG

Scratch

Smudginess

Fracture

ENG
ENG

Blemish detection

Testing result

 Smudginess

The chip surface is smudgy

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Blemish detection

Testing result

Smudginess

The chip surface is smudgy

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ENG

Scratch

Smudginess

Fracture

ENG
ENG

Blemish detection

Testing result

Smudginess

The chip surface is smudgy

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企业优势

Blemish detection

Testing result

Smudginess

The chip surface is smudgy

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ENG

MEMS Silicon microphone 

Accept unit effect

Restricted by user confidentiality agreement,the effect of this case using the demonstration diagram.

ENG
ENG

Tin Plating 

NG-Solder paste overflows to components

Tin Plating 

NG-Diaphragm broken

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企业优势

Tin Plating 

NG-Solder paste connection

Tin Plating 

NG-Solder paste misalignment

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ENG

MEMS Silicon microphone 

Accept unit effect

Restricted by user confidentiality agreement,the effect of this case using the demonstration diagram.

ENG
ENG

Tin Plating 

NG-Solder paste overflows to components

Tin Plating 

NG-Diaphragm broken

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企业优势

Tin Plating 

NG-Solder paste connection

Tin Plating 

NG-Solder paste misalignment

企业优势
ENG

Tin Plating 

NG-Solder paste disconnect

Sealing Glue

NG-Solder paste drops to component

ENG
ENG

Sealing Glue

NG-No glue spillage

Sealing Glue

NG-Gold wire deformation

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Sealing Glue

NG-Glue  overflowed into ground loop

Sealing Glue

NG-MEMS die skewing

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ENG

Tin Plating 

NG-Solder paste disconnect

Sealing Glue

NG-Solder paste drops to component

ENG
ENG

Sealing Glue

NG-No glue spillage

Sealing Glue

NG-Gold wire deformation

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企业优势

Sealing Glue

NG-Glue  overflowed into ground loop

Sealing Glue

NG-MEMS die skewing

企业优势
ENG

MEMS Die

NG-MEMS die excess epoxy

MEMS Die

NG-MEMS die too little glue / no glue spillage

ENG
ENG

MEMS Die

NG-Diaphragm abnormal

MEMS Die

NG-MEMS die chip

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企业优势

MEMS Die

NG-Diaphragm halo

MEMS Die

NG-Diaphragm contaminate

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ENG

MEMS Die

NG-MEMS die excess epoxy

MEMS Die

NG-MEMS die too little glue / no glue spillage

ENG
ENG

MEMS Die

NG-Diaphragm abnormal

MEMS Die

NG-MEMS die chip

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企业优势

MEMS Die

NG-Diaphragm halo

MEMS Die

NG-Diaphragm contaminate

企业优势
ENG

MEMS Die

NG-MEMS die component serial numbers do not match

Wire Bond

NG-Gold wire upwarp

ENG
ENG

Wire Bond

NG-Gold wire no making /

more making

Wire Bond

NG-Gold wire collapse / bolt

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企业优势

Wire Bond

NG-Gold wire cross

Wire Bond

NG-Ball beyond PAD

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ENG

MEMS Die

NG-MEMS die component serial numbers do not match

Wire Bond

NG-Gold wire upwarp

ENG
ENG

Wire Bond

NG-Gold wire no making /

more making

Wire Bond

NG-Gold wire collapse / bolt

企业优势
企业优势

Wire Bond

NG-Gold wire cross

Wire Bond

NG-Ball beyond PAD

企业优势