Richer and more timely

WE ARE ENERGY

2022


Energy kop Education Base was established<br> Establishment of semiconductor Sealing and Testing Industry College (equipment and core parts application training)<br> Develop high precision FC Bond equipment<br> Develop Mini&Micro LED mass transfer equipment<br> Develop a new generation of sub-micron chip, transparent object surface defect detection (AOI) equipment<br> Development of a new generation of ultrasonic lead bonding (WB) equipment version 2.0

Previous

Next


Previous

Next