March 2, 2023, hosted by Suzhou Hangdian Digital Intelligent Technology Co., LTD., Shenzhen Terminal Electronic Manufacturing Industry Association, Guangdong Electronics Society SMT committee "Semiconductor Packaging Manufacturing International Forum and SiP system level Packaging Status quo and development trend Conference" was held in Suzhou Shihu Jinling Garden Hotel, domestic industry, education and research representatives gathered together. The development trend of SIP system - level encapsulation is discussed deeply.
The theme of this forum is "Current Situation and Development Trend of SiP system Level Packaging", aiming to provide intellectual support and innovation guidance for the future development of the industry by sharing the latest technologies and ideas, combined with the current situation of the international and domestic industries.
Prof. Zhu Huilong, Academician of the International Eurasian Academy of Sciences, Chief Scientist of Research Center for Integrated Circuit Pilot Technology and Researcher of Institute of Microelectronics, Chinese Academy of Sciences; Prof. Xu Hongkun, Academician of South African Academy of Sciences, Academician of Academy of Developing Countries, Hangzhou Dianzi University; As well as a number of well-known industry experts around the theme of the conference made a wonderful report. They had comprehensive and in-depth discussions on frontier technology, development trend, application environment, market prospect and other aspects, and shared their research results and practical experience.
Dr. Zhou Jia, President of ENERGY Research Institute, was invited to attend and hosted a roundtable meeting. He had a dialogue with academician representatives, senior experts in semiconductor industry and semiconductor equipment enterprises on "Current situation and future challenges of SiP system level Packaging", aiming at adapting to the development of market technology and keeping up with the new changes in the electronic manufacturing industry. Provide impetus for the future development of domestic semiconductor industry and grasp the direction.
Under the current international situation, SiP is an important path to achieve rapid industrial follow-up and development, and to some extent, it represents the development direction of the semiconductor industry. According to the analysis of relevant professional institutions forecast, by this year, only the RF front-end module SiP package market size will reach 5.3 billion dollars, with a compound growth rate of 11.3%.
As the development of global terminal electronic products continues to move towards the trend of thin, short, multi-functional, low power consumption, the requirements for space saving, function improvement, and power consumption reduction are increasingly high, chip development from the pursuit of power consumption reduction and performance improvement, to more pragmatic to meet the needs of the market, SiP is an important way to achieve this goal. Represents the direction of the industry to a large extent.
System level packaging (SiP) technology is more and more favored by industry experts, scholars and entrepreneurs because of its short R&D and manufacturing cycle, low cost and relatively independent and controllable industrial chain. In particular, the arrival of the 5G era drives the development of the semiconductor industry, promotes the demand for SiP and other advanced packaging, and becomes a new growth driver in the field of advanced packaging. From the perspective of the overall industry development, the boundary between the front road, the middle road and the back road will become more and more blurred, and the development of SiP has become the preferred choice for the diversified development of Chinese semiconductor enterprises at the current stage.
In the future, ENERGY will continue to increase research and development investment, further strengthen the industry experts and enterprises continue to carry out more in-depth cooperation, in order to promote the healthy development of semiconductor packaging industry, promote industrial change and improve international competitiveness.