On June 18-19, the China IC Packaging Materials Technology and Market Forum hosted by ASIACHEM was held in Wuxi. Hundreds of professional representatives from Yunnan Tin Industry, Shanghai Integrated Circuit Fund, Shenzhen Research Institute of Chinese Academy of Sciences, ENERGY, Toray, Nagase, AGC, Mitsubishi, Daxing Materials, Matsushita Electric, etc., gathered in Wuxi , In-depth discussion of the new progress and development trend of the industry.
On the morning of the 19th, the conference organizer organized participating entrepreneurs and experts to visit Energy Intelligent Technology Wuxi Co., Ltd. Mr. Wu Chao, the general manager of ENERGY, warmly received the visiting group and introduced the development history of the company to the experts in the meeting room of the Intelligent Manufacturing Center. During the exchange, he gave detailed answers to various questions raised by the visitors. After the meeting, the ENERGY technical team accompanied the visiting entrepreneurs and experts to visit the ENERGY Intelligent Manufacturing Center.
The IC package substrate, also known as the IC carrier board, is directly used to mount the chip, which not only provides support, protection, and heat dissipation for the chip, but also provides an electronic connection between the chip and the PCB motherboard. According to the estimates of ASIACHEM, the global IC packaging materials market reached 20 billion U.S. dollars in 2018, of which IC packaging substrates accounted for approximately 7.3 billion U.S. dollars. The global IC packaging substrate market is growing steadily, and it is predicted to exceed US$10 billion in 2022.
The IC packaging substrate market has been in a stage of steady growth in recent years, and recently there have been rumors that Taiwan packaging and testing plants are out of stock for IC packaging substrates. Some IC packaging substrate companies in the world have begun to plan to expand production. In November 2018, Ibiden stated that it would invest a total of 70 billion yen (approximately RMB 4.2 billion) in Ogaki Central Business Plant and Ogaki Business Plant from 2019 to 2021. To set up new production lines and update equipment, so that the company's IC packaging substrate will increase its annual production capacity by about 50% in 2021.
Due to the high technical barriers and capital investment of IC packaging substrates, the current global packaging substrate market is basically dominated by PCB companies in Japan, Taiwan, South Korea and other regions such as UMTC, Ibiden, SEMCO, Nanya PCB, Kinsus, etc. The top ten companies With a market share of over 80%, the industry concentration is relatively high.
The local PCB companies in mainland China are still in their infancy and early growth in the past ten years. Most of them are engaged in the production of low-end PCB products and do not have the conditions to enter the IC packaging substrate industry. At present, only a few mainland PCB companies have begun to develop and mass produce IC packaging substrates.
As a high-tech innovative enterprise, ENERGY focuses on the packaging and testing fields of communication modules, power modules, sensors, cameras, etc., to provide customers with more cost-effective automation equipment robots and remote maintenance system solutions. ENERGY's core advantages include advanced optical vision algorithms Based on technology, micron motion control technology, intelligent interactive operating system technology, and comprehensive customer product process technology, ENERGY has successfully developed five series of products such as H17\S17\M17\C18\T18.
The chip inspection and sorting robot S17 series launched by ENERGY is compatible with various semiconductor chip applications, and is suitable for sapphire substrates, gold-plated substrates, silver-plated substrates, silicon substrates, silicon carbide substrates, gallium arsenide substrates, etc. Thin, super large, heterogeneous, 3D appearance chip detection and sorting.
ENERGY intelligent T18 high-precision series rely on more flexible switching function, more precise placement mechanism, safer placement system, faster micro-customization iteration and has been trusted by customers.