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IGBT power module multi-chip system packaging, China's rapid development

IGBT power module multi-chip system packaging, China's rapid development

  • 分类:News Media
  • Author:恩纳基智能科技
  • 来源:
  • 发布时间:2022-05-07
  • Visits:0

IGBT is the core component of new energy vehicle electric drive, industrial control frequency converter, photovoltaic wind power, energy storage inverter and charging pile. Before the outbreak of new energy vehicles, they have been widely used in household appliances, industrial control and other fields, with broad market prospects.

IGBT power module multi-chip system packaging, China's rapid development

[Summary]IGBT is the core component of new energy vehicle electric drive, industrial control frequency converter, photovoltaic wind power, energy storage inverter and charging pile. Before the outbreak of new energy vehicles, they have been widely used in household appliances, industrial control and other fields, with broad market prospects.

  • 分类:News Media
  • Author:恩纳基智能科技
  • 来源:
  • 发布时间:2022-05-07
  • Visits:0
Information

IGBT is a composite fully controlled voltage driven power semiconductor device, the "CPU" in the modern power electronics industry, the main function is power conversion. Development since the 1980 s to now, the chip technology has experienced seven generations upgrade, now the IGBT has become set low on state voltage, fast switching speed, high low voltage loss, large current good thermal stability, and so on numerous features at a suit, and these technical characteristics is IGBT replace old bipolar tube as the main cause of circuit fabrication of electronic devices.

 

 

IGBT is the core component of new energy vehicle electric drive, industrial control frequency converter, photovoltaic wind power, energy storage inverter and charging pile. Before the outbreak of new energy vehicles, they have been widely used in household appliances, industrial control and other fields, with broad market prospects.

 

1. IGBT power module multi-chip system packaging status

 

China has become the world's largest IGBT market. According to Yole data, China's IGBT industry output will reach 26 million in 2021, and the demand will be about 132 million. It is estimated that the output of IGBT industry in China will reach 41 million in 2022, and the demand is about 156 million. In the next five years, China's new energy vehicle market will maintain strong growth, automotive IGBT market scale is huge.

 

Data source: Yole, China Business Industry Research Institute

 

BESI and INFOTECH monopolize the domestic market for IGBT chip mounting equipment in the segmented field. INFOTECH, which has a market share of about 45%, is more suitable for the soldering process, and its main customers in China are Sijing, MACRO micro, CRRC, SMIC, Infineon, etc. BESI market share of about 30%, more suitable for solder paste technology, the main domestic customers are Star, Infineon, Silanwei and so on.

 

IGBT is related to the basic product of national economic development, such an important IGBT, China has to face the embarrassing situation of relying on imports for a long time. With the gradual improvement of industry prosperity and the promotion of policies, there are also many new entrants to seize the market. [intelligent technology wuxi co., LTD., independent research and development of M18 multichip intelligent SMT equipment, also suitable for IGBT chip solder paste/two pieces pasted on the welding process, the main customers are domestic starr, macro to micro, byd, silan, enlightenment, core, etc., at a relatively mature and rich product process application support with customer.

 

2、Comparison of packaging and patch equipment of IGBT power module multi-chip system at home and abroad

 

Equipment manufacturer INFOTECH BESI ENG
Equipment model IC1200 Datacon 2200EVO M18series
SMT precision ≈±15um ±7um ±25um/±15um/±10um
UPH 4~5k 1.5~2k 3~4K
Equipment delivery 90~180days 90~180days 60~90days
Regular stock delivery time >14days >14days 2~3days

 

Founded in 2016, Energy Intelligent Technology Wuxi Co., Ltd. focuses on the service of communication module, power module, sensor module, camera module and other micro-assembly fields. In the past 5 years, through the independent research and development of multi-axis drive control system technology, sub-pixel image algorithm technology, precision optical design technology, PC-Base real-time software technology, precision mechanical design and system engineering technology, to provide users with more flexible, more stable, more accurate, more cost-effective intelligent equipment. Its products have also served new energy vehicles, power electronics and other high technical threshold and certification barriers of chip packaging equipment.

 

 

3、IGBT industrial chain supporting is insufficient, and the gap with foreign countries is obvious

 

At present, China's IGBT industry has been able to have a certain industrial chain coordination capacity, but domestic IGBT technology in chip design, wafer manufacturing, module packaging and other aspects are at the initial stage. Wafer manufacturing, backplane thinning and packaging are the main difficulties in IGBT manufacturing technology, and there is an obvious gap between us and foreign enterprises in these aspects.

 

According to IGBT practitioners, currently domestic IGBT is mainly limited by the bottleneck of wafer production. Firstly, there is no professional OEM for IGBT. The original 8-inch groove IGBT products are mainly OEM in Huahong, but IGBT is not the main business of Huahong, and the product quota is extremely scarce and the price is high. However, with the completion and expansion of SMIC's shaoxing plant and Qingdao Xinen semiconductor's fabs, we believe that the situation will change significantly.

 

 

In addition to wafer production, there are also constraints on packaging. The heat dissipation efficiency of IGBT is much higher than that of industrial grade. The temperature in the inverter is up to 120℃, and strong vibration conditions should also be considered. Therefore, the packaging requirements are much higher than industrial grade. The main purpose of IGBT packaging is heat dissipation, its key is the material. In terms of IGBT packaging materials, Japan is far ahead in the world, Germany and the United States are following the trend, and China's material science is relatively backward.

 

Therefore, it can be seen that IGBT is a company highly dependent on the process details of the production line. Taking infineon's own report as an example, for the same design, the performance of products produced on 6-inch and 8-inch wafer production lines is greatly different, and the performance of products produced on the same two 8-inch wafer production lines is greatly different. This means that design firms cannot exist independently of OEM support. Therefore, the best route is IDM, which is also the only way for IGBT enterprises to become big and strong.

 

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Part of IGBT head company introduction

 

Star Semiconductor:

Jiaxing Star Semiconductor Co., LTD is a leading enterprise in IGBT field in China. Founded in April 2005, it is a state-level high-tech enterprise specializing in r&d, production and sales of power semiconductor chips and modules, especially IGBT chips and modules. The main products of the company are power semiconductor components, including IGBT, MOSFET, IPM, FRD, SiC and so on. The products have been successfully applied in the fields of new energy vehicles, frequency converters, inverter welders, UPS, PHOTOVOLTAIC/wind power generation, SVG, white appliances and so on.

 

 

 

Macro micro:

Jiangsu Hongwei Technology Co., LTD., national High-tech Industrialization Demonstration Project base, national IGBT and FRED standard drafting unit. Focus on the design, development, production and sales of new power semiconductor chips, discrete devices and modules, such as FRED, VDMOS, IGBT chips, discrete devices, standard modules and customized modules (CSPM), etc. Its products are widely used in inverter, welding machine, UPS power supply, charging pile, photovoltaic inverter, power quality management, household appliances and many other fields.

 

 

 

Silan micro:

Hangzhou Silan Microelectronics Co., Ltd. is one of the largest integrated circuit chip design and manufacturing (IDM) enterprises in China, specializing in integrated circuit chip design and semiconductor microelectronics related products production. The company's technology and products cover many fields of consumer products, and it maintains a leading position in many technical fields such as green power chip technology, MEMS sensor technology, LED lighting and display technology, high voltage intelligent power module technology, third generation power semiconductor device technology, digital audio and video technology, etc. At the same time, it provides customers with targeted chip product series and systematic application solutions based on its accumulation in many chip design fields.

 

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