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2017

In April ,2017, H17 Holder automatic plate setting and detection robot was successfully developed and entered the field of camera module microassembly<br>

In August ,2017, S17 high-precision intelligent sorting equipment was successfully developed and entered the field of bare chip sorting<br>

In December ,2017, T18 high-precision intelligent mounting equipment was successfully developed and entered the field of communication module sealing and testing

2017

[Summary]In April ,2017, H17 Holder automatic plate setting and detection robot was successfully developed and entered the field of camera module microassembly<br>

In August ,2017, S17 high-precision intelligent sorting equipment was successfully developed and entered the field of bare chip sorting<br>

In December ,2017, T18 high-precision intelligent mounting equipment was successfully developed and entered the field of communication module sealing and testing

Information
In January 2017, H17 entered the CIS field
 
   In May 2017, S17 entered the DS field
 
   In November 2017, T18 entered the field of communication module packaging and testing

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