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ENERGY (ENG) appeared at China International Optoelectronic Expo

ENERGY (ENG) appeared at China International Optoelectronic Expo

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  • 发布时间:2019-09-11
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From September 4th to 7th, the 21st China International Optoelectronic Expo (CIOE China Optical Expo) opened at the Shenzhen Convention and Exhibition Center.

ENERGY (ENG) appeared at China International Optoelectronic Expo

[Summary]From September 4th to 7th, the 21st China International Optoelectronic Expo (CIOE China Optical Expo) opened at the Shenzhen Convention and Exhibition Center.

  • 分类:News
  • Author:
  • 来源:
  • 发布时间:2019-09-11
  • Visits:0
Information

From September 4th to 7th, the 21st China International Optoelectronic Expo (CIOE China Optical Expo) opened at the Shenzhen Convention and Exhibition Center. The exhibition covers an area of 110,000 square meters, with six major themes including Optical Communication Exhibition, Laser Technology and Intelligent Manufacturing Exhibition, Infrared Technology and Application Exhibition, Precision Optics Exhibition, Lens and Camera Module Exhibition, Photoelectric Sensing Exhibition, and Optoelectronics Innovation Exhibition. At the exhibition, 2,000 optoelectronic companies and over 4,000 high-quality optoelectronic brands from more than 30 countries and regions gathered together to help the high-quality development of the industry.

 

恩纳基(ENG)亮相中国国际光电博览会

 

As a semiconductor equipment supplier of the leading company in optical components and optical modules, ENERGY Intelligent Technology brought three series of S\M\T automation equipment robots and a newly built remote after-sales service system based on the MES&AR system to the exhibition, and demonstrated its independence. High-speed optical module placement equipment developed by T18 (PRO).

 

恩纳基(ENG)亮相中国国际光电博览会

 

恩纳基(ENG)亮相中国国际光电博览会

 

   T18(PRO) is a high-speed optical module placement equipment used in the field of optical communications. It can realize the one-time placement of multiple chips at the same time, and is automatically compatible with multiple incoming materials such as wafer, tray, and Gel-park; the equipment also has a glue-dipping function and a glue-dispensing upgrade function. The suction nozzle can be replaced automatically, and the PCBA single tube can be automatically loaded and unloaded, and the material box can be in and out.
 
   The accuracy of T18 (PRO) is up to 5 microns, and the conventional high-speed can reach 7 microns; the structure uses marble to make the machine more stable; in terms of chip force, it can be adjusted and fed back according to the grams of the chip in real time. Through this series of functions and technologies, the safety and efficiency of placement are guaranteed.

 

恩纳基(ENG)亮相中国国际光电博览会

 

In this exhibition, ENERGY has been recognized by peers and experts in the field of semiconductor packaging and testing at home and abroad, and there are an endless stream of guests who come to visit. Performance is the fundamental element for equipment manufacturers to maintain their competitiveness. ENERGY will continue to develop higher-precision smart semiconductor packaging equipment to help optical communication module companies achieve upgrades!

 

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