The 21st China International Optoelectronic Expo (CIOE) in 2019 will be held at the Shenzhen Convention and Exhibition Center from September 4th to 7th, 2019.
China International Optoelectronic Expo is a comprehensive exhibition of the global optoelectronic industry with a large scale and influence, covering optical communications, laser, infrared, precision optics, LED and semiconductor, sapphire and other optoelectronic industry sectors. The exhibition provides a display area of 110,000 square meters, a total of 3,200 well-known photoelectric brands at home and abroad will participate in the exhibition, and the professional audience is expected to reach 80,000. Six major international pavilions from Germany, Denmark, Canada, South Korea, the United States, and Japan gathered at the Shenzhen Convention and Exhibition Center to showcase cutting-edge technologies and products in the global optoelectronic industry. In addition, more than 30 cutting-edge academic, industry and application summits will be held during the exhibition.
With the development of the optoelectronic industry, optoelectronic technology has grown strongly in many fields. Among them, the scale of China's semiconductor market continues to increase as a global share. According to Gartner data, the global semiconductor industry revenue in 2017 was 420.4 billion U.S. dollars, and the packaging and testing industry revenue was 53.3 billion U.S. dollars, accounting for 13%. Therefore, the packaging and testing industry is the starting point for China's semiconductors to catch up with the world. According to statistics from China Semiconductor Industry Association (CSIA), the total sales of China's integrated circuit industry in 2017 were 541.1 billion yuan, of which the packaging and testing industry was 188.97 billion yuan, accounting for 35%, a year-on-year increase of 20.8%, far exceeding the international growth rate of 4.5% in the same period .
In the packaging and testing business, with the development of new industries such as 5G, AI, and the Internet of Things, chips are becoming more differentiated and complex, and packaging and testing equipment must have corresponding functions to complete the work. Therefore, in order to meet the requirements of advanced packaging technology in the domestic and international markets, we continue to strengthen research and development efforts in the field of advanced packaging technology to accelerate our deployment. This time ENERGY Intelligent Technology will bring three series of S\M\T automation equipment robots and a new after-sales service system based on MES&AR to participate in the exhibition. All colleagues in the industry are welcome to visit and discuss.
Exhibition location: 60 meters in front of Gate 1 of Hall 2, Shenzhen Convention and Exhibition Center 2C01
Company address: Building 30-23 (Management Center)/Building 30-32 (Intelligent Manufacturing Center) Phase II Optoelectronic New Material Science and Technology Park, Liangxi District, Wuxi City
Contact: +86 510 6856 7628 (Sales Department)
Company email: firstname.lastname@example.org
Company website: www.eng-wx.com