huiyu
S17 (AOI) chip and lens sorting and inspection robot
S17 (AOI) chip and lens sorting and inspection robot
Controllable pickup and release force, chip 2D detection, MAP counting, classification, Wafer to Tray, Wafer to Wafer, automatic loading and unloading
M18 multi-chip module bonding robot
M18 multi-chip module bonding robot
Suitable for multi-chip bonding process MCM, dot, brush, and glue process; bond the solder pads, the bonding force is controllable, Max to DBC, Wafer to DBC, support multi-tip devices
T18 high-precision chip bonding robot
T18 high-precision chip bonding robot
The highest bonding accuracy is ±3 microns, the highest bonding angle is ±0.1°, the pick and bonding force is controllable, compatible with Tray&Wafer, tray & PCB automatic feeding and discharging device, and chip bottom vision device
EX20 high precision eutectic bonding robot
EX20 high precision eutectic bonding robot
The highest bonding accuracy is ±1.5 microns, the highest bonding angle is ±0.05°, reliable temperature rise and fall control, the temperature rise and fall rate can reach 100℃/s, compatible with multi-size Tary loading and unloading, chip bottom vision device
WB20 Ultrasonic Wire Bonding Machine
WB20 Ultrasonic Wire Bonding Machine
Ultra-precision micro-pitch wire bonding; high quality and consistency at the end of the wire; ultra-quiet workbench; high-precision ultrasonic generator; precise wire feeding system; high-speed bonding capability
A18 intelligent appearance inspection equipment
A18 intelligent appearance inspection equipment
The highest detection accuracy is 0.25μm; the highest detection capacity is 50 pieces; the false detection rate is less than 2%; the detection rate is less than or equal to 0.5%; the microscope level lens can be customized; the detection results are intelligently combined

Download      Consult

S17 (AOI) chip and lens sorting and inspection robot

Controllable pickup and release force, chip 2D detection, MAP counting, classification, Wafer to Tray, Wafer to Wafer, automatic loading and unloading
Retail price
0.0
Market price
0.0
Number of views:
1000
Product serial number
Quantity
-
+
Stock:
0
Category
1
Number of views:
1000
产品参数
Parameters
产品特点
产品视频
产品参数

We could not find any corresponding parameters, please add them to the properties table
S17 S17 S17

  Accurate chip recognition rate

Special lighting system
Suitable for a variety of specifications and material chips
Support the sorting of different Bins

MappingMapping intelligent retrieval

Chip inspection for defective products
Friendly user interface
 

Adapt to a variety of vehicles and materials

Gelpak, Wafer, frame
Waffle box, lens, To tube holder, PCB, etc.
 

 

Product Parameters

 

Optional


model
S17
S17Plus
S17Pro
(Flip FC, bottom UL, preset ST)
Suction method
Rotary suction
Vertical suction
Vertical suction
Placement accuracy
±38μm@3σ  
±25μm@3σ
±25μm@3σ/±15um@3σ
Place θ
±3°
±2°
±2°/±1°
Wafer table (wafer)
MAX.8吋

MAX.12吋

MAX.12吋
Bond head θ range

/Nonfunctional

270°
360°
Z travel
8mm
80mm
20mm
Working desk size
MAX.200*250mm
Wafer size affects this size
MAX.200*250mm
Wafer size affects this size
MAX.200*250mm
Wafer size affects this size
Chip size
0.25mm~8mm thickness≥100um
0.18mm~16mm thickness≥70um
0.18mm~16mmthickness≥65um
Size, weigh
1100x 950 x 1650 mm
≈700Kg
1400x1900 x 1750 mm
≈1700Kg
1500x 1200 x 1750 mm
≈2000Kg
Picking force control
Manual adjustment, spring force control                     
Controllable range:10~300g
Automatic voice coil control
Controllable range:10~300g
Automatic voice coil control
Controllable range:10~300g
Production capacity(UPH)
MAX.10000pcs/hr
Count according to the density of the fixture matrix
MAX.5000pcs/hr
Count according to the density of the fixture matrix
MAX.5000pcs/hr  /MAX.3000pcs/hr 
Count according to the density of the fixture matrix
Detection function
Chip dot recognition, chip defect similarity recognition
Chip dot recognition, chip defect similarity recognition
Chip dot recognition, chip defect similarity recognition
Health function
Deionization device, operating window light curtain 
Deionization device, operating window light curtain 
Deionization device, operating window light curtain 
Intelligent authority
Operator/engineer operation authority, Mapping map reading, generation (optional)
Operator/engineer operation authority, Mapping map reading, generation (optional)
Operator/engineer operation authority, Mapping map reading, generation (optional)
Optional combination
1.Wafer wafer table size: MAX. 8-inch wafer (Plastic ring or iron ring), 4-inch chip box, 2-inch chip box
2.Workbench compatible: 2 inch chip box, 4 inch chip box, MAX.6 inch iron ring, MAX.10 inch daughter and mother ring, custom fixture
3.Customizable AOI function
4.S17Pro optional flip 90-180 °; bottom recognition

 

Previous
Next