

S17 (AOI) chip and lens sorting and inspection robot
Controllable pickup and release force, chip 2D detection, MAP counting, classification, Wafer to Tray, Wafer to Wafer, automatic loading and unloading

M18 multi-chip module bonding robot
Suitable for multi-chip bonding process MCM, dot, brush, and glue process; bond the solder pads, the bonding force is controllable, Max to DBC, Wafer to DBC, support multi-tip devices

T18 high-precision chip bonding robot
The highest bonding accuracy is ±3 microns, the highest bonding angle is ±0.1°, the pick and bonding force is controllable, compatible with Tray&Wafer, tray & PCB automatic feeding and discharging device, and chip bottom vision device

EX20 high precision eutectic bonding robot
The highest bonding accuracy is ±1.5 microns, the highest bonding angle is ±0.05°, reliable temperature rise and fall control, the temperature rise and fall rate can reach 100℃/s, compatible with multi-size Tary loading and unloading, chip bottom vision device

WB20 Ultrasonic Wire Bonding Machine
Ultra-precision micro-pitch wire bonding; high quality and consistency at the end of the wire; ultra-quiet workbench; high-precision ultrasonic generator; precise wire feeding system; high-speed bonding capability

A18 intelligent appearance inspection equipment
The highest detection accuracy is 0.25μm; the highest detection capacity is 50 pieces; the false detection rate is less than 2%; the detection rate is less than or equal to 0.5%; the microscope level lens can be customized; the detection results are intelligently combined
EX20 high precision eutectic bonding robot
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Maximum bonding accuracy ±1.5um More precise chip bonding
Sub-pixel chip recognition rate
Multi-function feeding, dual soldering head bonding
Precise force control\height measurement
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Reliable temperature rise control Healthier production control, compatible with MES interface\ESD protection
Mapping count\retrieve\classification
Chip inspection for defective products
User-friendly interface\Comprehensive wafer map library
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More flexible adaptation to product switching Suitable for: 5G communication chip COC\high power laser chip\
laser and other chips eutectic die bonding
Military industry: metal shell multi-chip eutectic die bonding
Gold-tin bonding of gallium arsenide and gallium nitride die
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Product Parameter
■ Optional
Model | EX20 | EX20 Plus | EX20 Pro |
Placement accuracy | ±5μm@3σ | ±3μm@3σ | |
Angle | ≤0.1° | ≤0.05° | |
Wafer table (wafer) | 6 inch wafer | 6 inch wafer | |
Working desk size Adapt to the size of the material tray (effective working stroke) |
Tray loading 120*120(4*2 inch) |
Tray loading 120*120(4*2 inch) |
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Chip size | 0.15~5mm | 0.15~5mm | |
Size, weigh | 1700*1400*2100 2500KG |
1700*1400*2100 2500KG |
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Picking force control | Automatic voice coil control Controllable range:10~300g |
Automatic voice coil control Controllable range:10~300g |
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Eutectic bonding | Programmable ramp rates up to 450ºC | Programmable ramp rates up to 450ºC | |
Detection function | Chip dot recognition, chip defect similarity recognition | Chip dot recognition, chip defect similarity recognition | |
Health function | Deionization device, operating window light curtain | Deionization device, operating window light curtain | |
Intelligent authority | Operator/engineer operation authority, Mipping map reading, generation (optional) | Operator/engineer operation authority, Mipping map reading, generation (optional) | |
Optional combination: :1、Wafer loading 2、Tray loading 3、Automatic suction nozzle change |
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Energy Intelligent Technology Wuxi Co.,Ltd
E-mail:market@eng-wx.com
Address: Building 8, Area C, Jinshan North Science and Technology Park, No.90 Huaian Road, Liangxi District, Wuxi City, Jiangsu Province, China


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