huiyu
S17 (AOI) chip and lens sorting and inspection robot
S17 (AOI) chip and lens sorting and inspection robot
Controllable pickup and release force, chip 2D detection, MAP counting, classification, Wafer to Tray, Wafer to Wafer, automatic loading and unloading
M18 multi-chip module bonding robot
M18 multi-chip module bonding robot
Suitable for multi-chip bonding process MCM, dot, brush, and glue process; bond the solder pads, the bonding force is controllable, Max to DBC, Wafer to DBC, support multi-tip devices
T18 high-precision chip bonding robot
T18 high-precision chip bonding robot
The highest bonding accuracy is ±3 microns, the highest bonding angle is ±0.1°, the pick and bonding force is controllable, compatible with Tray&Wafer, tray & PCB automatic feeding and discharging device, and chip bottom vision device
EX20 high precision eutectic bonding robot
EX20 high precision eutectic bonding robot
The highest bonding accuracy is ±1.5 microns, the highest bonding angle is ±0.05°, reliable temperature rise and fall control, the temperature rise and fall rate can reach 100℃/s, compatible with multi-size Tary loading and unloading, chip bottom vision device
WB20 Ultrasonic Wire Bonding Machine
WB20 Ultrasonic Wire Bonding Machine
Ultra-precision micro-pitch wire bonding; high quality and consistency at the end of the wire; ultra-quiet workbench; high-precision ultrasonic generator; precise wire feeding system; high-speed bonding capability
A18 intelligent appearance inspection equipment
A18 intelligent appearance inspection equipment
The highest detection accuracy is 0.25μm; the highest detection capacity is 50 pieces; the false detection rate is less than 2%; the detection rate is less than or equal to 0.5%; the microscope level lens can be customized; the detection results are intelligently combined

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EX20 high precision eutectic bonding robot

The highest bonding accuracy is ±1.5 microns, the highest bonding angle is ±0.05°, reliable temperature rise and fall control, the temperature rise and fall rate can reach 100℃/s, compatible with multi-size Tary loading and unloading, chip bottom vision device
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EX20 EX20 EX20

Maximum bonding accuracy ±1.5um

More precise chip bonding
Sub-pixel chip recognition rate
Multi-function feeding, dual soldering head bonding
Precise force control\height measurement

Reliable temperature rise control

Healthier production control, compatible with MES interface\ESD protection
Mapping count\retrieve\classification
Chip inspection for defective products
User-friendly interface\Comprehensive wafer map library

More flexible adaptation to product switching

Suitable for: 5G communication chip COC\high power laser chip\
laser and other chips eutectic die bonding
Military industry: metal shell multi-chip eutectic die bonding
Gold-tin bonding of gallium arsenide and gallium nitride die

 

 

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Model EX20 EX20 Plus EX20 Pro
Placement accuracy ±5μm@3σ ±3μm@3σ  
Angle ≤0.1° ≤0.05°  
Wafer table (wafer) 6 inch wafer 6 inch wafer  
Working desk size
Adapt to the size of the material tray (effective working stroke)
Tray loading
120*120(4*2 inch)
Tray loading
120*120(4*2 inch)
 
Chip size 0.15~5mm 0.15~5mm  
Size, weigh 1700*1400*2100
2500KG
1700*1400*2100
2500KG
 
Picking force control Automatic voice coil control
Controllable range:10~300g
Automatic voice coil control
Controllable range:10~300g
 
Eutectic bonding Programmable ramp rates up to 450ºC Programmable ramp rates up to 450ºC  
Detection function Chip dot recognition, chip defect similarity recognition Chip dot recognition, chip defect similarity recognition  
Health function Deionization device, operating window light curtain  Deionization device, operating window light curtain   
Intelligent authority Operator/engineer operation authority, Mipping map reading, generation (optional) Operator/engineer operation authority, Mipping map reading, generation (optional)  
Optional combination: :1、Wafer  loading   2、Tray loading   3、Automatic suction nozzle change

 

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