huiyu
S17 (AOI) chip and lens sorting and inspection robot
S17 (AOI) chip and lens sorting and inspection robot
Controllable pickup and release force, chip 2D detection, MAP counting, classification, Wafer to Tray, Wafer to Wafer, automatic loading and unloading
M18 multi-chip module bonding robot
M18 multi-chip module bonding robot
Suitable for multi-chip bonding process MCM, dot, brush, and glue process; bond the solder pads, the bonding force is controllable, Max to DBC, Wafer to DBC, support multi-tip devices
T18 high-precision chip bonding robot
T18 high-precision chip bonding robot
The highest bonding accuracy is ±3 microns, the highest bonding angle is ±0.1°, the pick and bonding force is controllable, compatible with Tray&Wafer, tray & PCB automatic feeding and discharging device, and chip bottom vision device
EX20 high precision eutectic bonding robot
EX20 high precision eutectic bonding robot
The highest bonding accuracy is ±1.5 microns, the highest bonding angle is ±0.05°, reliable temperature rise and fall control, the temperature rise and fall rate can reach 100℃/s, compatible with multi-size Tary loading and unloading, chip bottom vision device
WB20 Ultrasonic Wire Bonding Machine
WB20 Ultrasonic Wire Bonding Machine
Ultra-precision micro-pitch wire bonding; high quality and consistency at the end of the wire; ultra-quiet workbench; high-precision ultrasonic generator; precise wire feeding system; high-speed bonding capability
A18 intelligent appearance inspection equipment
A18 intelligent appearance inspection equipment
The highest detection accuracy is 0.25μm; the highest detection capacity is 50 pieces; the false detection rate is less than 2%; the detection rate is less than or equal to 0.5%; the microscope level lens can be customized; the detection results are intelligently combined

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WB20 Ultrasonic Wire Bonding Machine

Ultra-precision micro-pitch wire bonding; high quality and consistency at the end of the wire; ultra-quiet workbench; high-precision ultrasonic generator; precise wire feeding system; high-speed bonding capability
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   Large travel effective working area

Multi-chip multi-wire bonding
Compatible with multi-standard wire diameter bonding
Customizable large-stroke effective bonding area

Bond disconnection detection alarm

General application of fine aluminum wire bonding field
Adapt to a variety of products and vehicles
Flexible customization

High image number visual flight shooting function

Gigabit high-speed industrial camera
Material before bonding
Bad recognition alarm

 

 

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Model WB20 WB20 Pro
Bonding Precision Max :XY≤±0.5μm Max :XY≤±0.1μm
Bonding Angle Max :45° Max : 90°
Working desk size XY effective stroke: 100*100mm
Angle of θ:360°
Welding Z:Max 3mm
XY effective stroke:150*150mm
Angle of θ:360°
Welding Z:Max 10mm
Bonding Power 0-2 watts (numerically adjustable) 0-2 watts (numerically adjustable)
Capacity MAX:15000/h
Count according to the product lead bonding line number、density of the fixture matrix
MAX:12000/h
Count according to the product lead bonding line number、density of the fixture matrix
Size, weigh 915*765*1380
≈260KG
1000*800*1500
≈600KG
Bonding Pressure
Control
Automatic voice coil control
Controllable range:15~200g
Automatic voice coil control
Controllable range:10~300g
Bonding Wire Diameter 18μm-50μm 18μm-50μm
Minimum weld spot
size/spacing
63μm*80μm/68μm 63μm*80μm/68μm
Up-down material Manual fixture type Feed cassette
Vacuum connection <-0.8bar(Fixture vacuum)
Transducer frequency 60-142kHZ
Force 10cN-400cN(±1cN)
Health function Electrostatic ion removal device
Intelligent authority Operator/engineer operation authority
Process Capability 1、Bonding force≥9g(Wire diameter1.5mil)
2、Solder joint thrust≥30g
3、Bonded substrate spacing:Min ≥0.5mm
4、Bonding wire diameter:0.7mil-2.0mil

 

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