S17 (AOI) chip and lens sorting and inspection robot
Controllable pickup and release force, chip 2D detection, MAP counting, classification, Wafer to Tray, Wafer to Wafer, automatic loading and unloading
M18 multi-chip module bonding robot
Suitable for multi-chip bonding process MCM, dot, brush, and glue process; bond the solder pads, the bonding force is controllable, Max to DBC, Wafer to DBC, support multi-tip devices
T18 high-precision chip bonding robot
The highest bonding accuracy is ±3 microns, the highest bonding angle is ±0.1°, the pick and bonding force is controllable, compatible with Tray&Wafer, tray & PCB automatic feeding and discharging device, and chip bottom vision device
EX20 high precision eutectic bonding robot
The highest bonding accuracy is ±1.5 microns, the highest bonding angle is ±0.05°, reliable temperature rise and fall control, the temperature rise and fall rate can reach 100℃/s, compatible with multi-size Tary loading and unloading, chip bottom vision device
WB20 Ultrasonic Wire Bonding Machine
Ultra-precision micro-pitch wire bonding; high quality and consistency at the end of the wire; ultra-quiet workbench; high-precision ultrasonic generator; precise wire feeding system; high-speed bonding capability
A18 intelligent appearance inspection equipment
The highest detection accuracy is 0.25μm; the highest detection capacity is 50 pieces; the false detection rate is less than 2%; the detection rate is less than or equal to 0.5%; the microscope level lens can be customized; the detection results are intelligently combined
WB20 Ultrasonic Wire Bonding Machine
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产品参数
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We could not find any corresponding parameters, please add them to the properties table
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Large travel effective working area Multi-chip multi-wire bonding
Compatible with multi-standard wire diameter bonding
Customizable large-stroke effective bonding area
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Bond disconnection detection alarm General application of fine aluminum wire bonding field
Adapt to a variety of products and vehicles
Flexible customization
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High image number visual flight shooting function Gigabit high-speed industrial camera
Material before bonding
Bad recognition alarm
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Product Parameter
■ Optional
| Model | WB20 | WB20 Pro |
| Bonding Precision | Max ：XY≤±0.5μm | Max ：XY≤±0.1μm |
| Bonding Angle | Max ：45° | Max ： 90° |
| Working desk size | XY effective stroke: 100*100mm Angle of θ：360° Welding Z：Max 3mm |
XY effective stroke:150*150mm Angle of θ：360° Welding Z：Max 10mm |
| Bonding Power | 0-2 watts (numerically adjustable) | 0-2 watts (numerically adjustable) |
| Capacity | MAX:15000/h Count according to the product lead bonding line number、density of the fixture matrix |
MAX:12000/h Count according to the product lead bonding line number、density of the fixture matrix |
| Size, weigh | 915*765*1380 ≈260KG |
1000*800*1500 ≈600KG |
| Bonding Pressure Control |
Automatic voice coil control Controllable range：15～200g |
Automatic voice coil control Controllable range：10～300g |
| Bonding Wire Diameter | 18μm-50μm | 18μm-50μm |
| Minimum weld spot size/spacing |
63μm*80μm/68μm | 63μm*80μm/68μm |
| Up-down material | Manual fixture type | Feed cassette |
| Vacuum connection | ＜-0.8bar（Fixture vacuum） | |
| Transducer frequency | 60-142kHZ | |
| Force | 10cN-400cN（±1cN） | |
| Health function | Electrostatic ion removal device | |
| Intelligent authority | Operator/engineer operation authority | |
| Process Capability | 1、Bonding force≥9g（Wire diameter1.5mil） 2、Solder joint thrust≥30g 3、Bonded substrate spacing：Min ≥0.5mm 4、Bonding wire diameter：0.7mil-2.0mil |
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Energy Intelligent Technology Wuxi Co.,Ltd
E-mail：market@eng-wx.com
Address: Building 8, Area C, Jinshan North Science and Technology Park, No.90 Huaian Road, Liangxi District, Wuxi City, Jiangsu Province, China
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