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S17 (AOI) chip and lens sorting and inspection robot
S17 (AOI) chip and lens sorting and inspection robot
Controllable pickup and release force, chip 2D detection, MAP counting, classification, Wafer to Tray, Wafer to Wafer, automatic loading and unloading
M18 multi-chip module bonding robot
M18 multi-chip module bonding robot
Suitable for multi-chip bonding process MCM, dot, brush, and glue process; bond the solder pads, the bonding force is controllable, Max to DBC, Wafer to DBC, support multi-tip devices
T18 high-precision chip bonding robot
T18 high-precision chip bonding robot
The highest bonding accuracy is ±3 microns, the highest bonding angle is ±0.1°, the pick and bonding force is controllable, compatible with Tray&Wafer, tray & PCB automatic feeding and discharging device, and chip bottom vision device
EX20 high precision eutectic bonding robot
EX20 high precision eutectic bonding robot
The highest bonding accuracy is ±1.5 microns, the highest bonding angle is ±0.05°, reliable temperature rise and fall control, the temperature rise and fall rate can reach 100℃/s, compatible with multi-size Tary loading and unloading, chip bottom vision device
WB20 Ultrasonic Wire Bonding Machine
WB20 Ultrasonic Wire Bonding Machine
Ultra-precision micro-pitch wire bonding; high quality and consistency at the end of the wire; ultra-quiet workbench; high-precision ultrasonic generator; precise wire feeding system; high-speed bonding capability
A18 intelligent appearance inspection equipment
A18 intelligent appearance inspection equipment
The highest detection accuracy is 0.25μm; the highest detection capacity is 50 pieces; the false detection rate is less than 2%; the detection rate is less than or equal to 0.5%; the microscope level lens can be customized; the detection results are intelligently combined

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A18 intelligent appearance inspection equipment

The highest detection accuracy is 0.25μm; the highest detection capacity is 50 pieces; the false detection rate is less than 2%; the detection rate is less than or equal to 0.5%; the microscope level lens can be customized; the detection results are intelligently combined
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A18 A18 A18

A18

Mainly detect the chip on the Wafer
Optional when performing chip appearance inspection
Autofocus\pickup force control function and chip sorting

A18 Plus

Mainly to detect the chip after mounting and wire bonding
Equipped with automatic loading and unloading module
High detection accuracy\fast speed\stable detection ability

 A18 Pro  

Line scan vision system

Mainly detect 4 inches \ 6 inches
 8-inch glass sheet\IR sheet\silicon wafer

 

 

Product Parameter

 

■ Optional

Model A18 A18Plus A18Pro  
Maximum detection accuracy 3um 2um 0.25um The minimum chip size of A18 and a18plus is 0.2mm * 0.2mm
CCD configuration quantity cameras*2 (one for front detection and one for back detection) Up to four cameras are supported  line scan camera*1 It can be selected according to the test requirements
Lens configuration 1X 2X 4X 10X 1X 2X 4X 10X 1X 2X 4X The lens with different magnification can be selected according to the product size and detection accuracy
Misjudgment rate / missed judgment rate Misjudgment rate: 2%, missed judgment rate: 0.5% - 1% Misjudgment rate: 1%, missed judgment rate: 0.1% - 0.5% Misjudgment rate: 1%, missed judgment rate: 0.1% - 0.5% Specific indicators are related to  customer product consistency
Chip size 1X---8.4 X7.5 mm
2X---4.2 X 3.25 mm
4X---2 X 1.5 mm
10X---0.9 X 0.7 mm		 1X---16.5 X 22.5 mm
2X---8.25 X 7.5 mm
4X---4 X 3.5 mm
10X---1.25 X 1 mm		 4 inch, 6 inch, 8 inch glass, IR, silicon Lens can be selected according to chip size
Size, weigh 1200X1000X1800mm(650KG） 1400X1000X1700mm(1000KG） 1600*1200*1550  
Product switching time (new process) 20min 15min 30min  
Production capacity(UPH) UPH>6K/hr UPH>12K/hr 6 inch （pattern) 25wph                                     8 inch（pattern) 15wph                                     (no pattern)50wph
If the auto focus function is selected, the UPH will decrease
Detection function Wafer appearance defect detection: dirt, scratch, defect, fracture, edge collapse, etc It mainly focuses on the appearance detection of MEMS chip, such as missing gold wire, wrong gold wire, glue amount detection, abnormal diaphragm detection, solder paste detection, edge chipping detection, surface dirt detection, surface damage detection, etc Chip appearance defect detection:
Surface dirt, cracks, scratches, etc		  
Intelligent authority        
Brief introduction of detection principle: high resolution color industrial camera, specific light source and lens are used to reflect chip surface defects on different channel images, and then image processing (image denoising, segmentation, image enhancement, image gray morphology, calibration, data statistics, geometry, rigid body transformation, high-precision matching, image comparison, image mosaic) is used to extract defects, Finally, the defect size is quantified by geometric fitting.
Note: the customer should provide the relevant information about the detection specifications and defect types of different detection areas, as well as the corresponding samples. The specific detection accuracy is affected by the product material.
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