huiyu
S17 (AOI) chip and lens sorting and inspection robot
S17 (AOI) chip and lens sorting and inspection robot
Controllable pickup and release force, chip 2D detection, MAP counting, classification, Wafer to Tray, Wafer to Wafer, automatic loading and unloading
M18 multi-chip module bonding robot
M18 multi-chip module bonding robot
Suitable for multi-chip bonding process MCM, dot, brush, and glue process; bond the solder pads, the bonding force is controllable, Max to DBC, Wafer to DBC, support multi-tip devices
T18 high-precision chip bonding robot
T18 high-precision chip bonding robot
The highest bonding accuracy is ±3 microns, the highest bonding angle is ±0.1°, the pick and bonding force is controllable, compatible with Tray&Wafer, tray & PCB automatic feeding and discharging device, and chip bottom vision device
EX20 high precision eutectic bonding robot
EX20 high precision eutectic bonding robot
The highest bonding accuracy is ±1.5 microns, the highest bonding angle is ±0.05°, reliable temperature rise and fall control, the temperature rise and fall rate can reach 100℃/s, compatible with multi-size Tary loading and unloading, chip bottom vision device
WB20 Ultrasonic Wire Bonding Machine
WB20 Ultrasonic Wire Bonding Machine
Ultra-precision micro-pitch wire bonding; high quality and consistency at the end of the wire; ultra-quiet workbench; high-precision ultrasonic generator; precise wire feeding system; high-speed bonding capability
A18 intelligent appearance inspection equipment
A18 intelligent appearance inspection equipment
The highest detection accuracy is 0.25μm; the highest detection capacity is 50 pieces; the false detection rate is less than 2%; the detection rate is less than or equal to 0.5%; the microscope level lens can be customized; the detection results are intelligently combined

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PL20-MA Semiconductor vacuum plasma cleaner

High stability, large-scale continuous production, unique electrode structure, high versatility, operation convenient, safety
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Friendly to environment, easy to operate

Replace traditional wet cleaning

Green environmental protection, low cost

Zero emission pollution

Ultra high frequency 13.56MHZ

Ultra high frequency 13.56MHZ

Plasma decontamination, surface activation

High sealing vacuum chamber

Can be customized

Multi-layer cavity size, customizable

Meet the requirements

Multiple gas channels supporting expansion ports

 

Product Parameter

 

Optional


Model       PL20-MA
Power frequency 40KHz/13.56MHz Gas flow control 0-500SCCM(MFC+-2%)
Capacity(L) 60\110\150\180\200 Gas channel Two-way (Addable):Ar、N2,H2、CF4、O2
Power (W) 0-1000(Adjustable) The layer number of
processing
11/15/17/17/21
Cavity dimensions(WxDxH) 400*450*400mm
500*450*500mm
500*500*600mm
500*600*600mm
500×580×700mm
Overall dimensions(WxDxH) 1000*1030*1630mm
1100*1030*1680mm
1200*1100*1730mm
1200*1200*1730mm
1250*1230*1790mm
Vacuum pump (Oil pump/dry pump + Roots combination) System control software self-developed V2.0
Vacuum degree 5-100Pa(Adjustable) Electrode ceramics Imported high frequency ceramics
Cavity material 316 stainless stee/imported aluminum alloy (Optional) Cavity temperature <30℃
Plasma generator 40KHz/13.56MHz(Optional) Control mode PLC + touch screen
Application field Products are suitable for optoelectronics, IGBT, MEMS, COMS and other semiconductor packaging links;
Plasma surface activation/cleaning, bonding after plasma treatment, plasma etching/activation, plasma degluing, plasma coating and
plating (hydrophilic, hydrophobic), enhanced binding, plasma coating, plasma ashing and surface modification and other occasions;

 

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