S17 (AOI) chip and lens sorting and inspection robot
Controllable pickup and release force, chip 2D detection, MAP counting, classification, Wafer to Tray, Wafer to Wafer, automatic loading and unloading
M18 multi-chip module bonding robot
Suitable for multi-chip bonding process MCM, dot, brush, and glue process; bond the solder pads, the bonding force is controllable, Max to DBC, Wafer to DBC, support multi-tip devices
T18 high-precision chip bonding robot
The highest bonding accuracy is ±3 microns, the highest bonding angle is ±0.1°, the pick and bonding force is controllable, compatible with Tray&Wafer, tray & PCB automatic feeding and discharging device, and chip bottom vision device
EX20 high precision eutectic bonding robot
The highest bonding accuracy is ±1.5 microns, the highest bonding angle is ±0.05°, reliable temperature rise and fall control, the temperature rise and fall rate can reach 100℃/s, compatible with multi-size Tary loading and unloading, chip bottom vision device
WB20 Ultrasonic Wire Bonding Machine
Ultra-precision micro-pitch wire bonding; high quality and consistency at the end of the wire; ultra-quiet workbench; high-precision ultrasonic generator; precise wire feeding system; high-speed bonding capability
A18 intelligent appearance inspection equipment
The highest detection accuracy is 0.25μm; the highest detection capacity is 50 pieces; the false detection rate is less than 2%; the detection rate is less than or equal to 0.5%; the microscope level lens can be customized; the detection results are intelligently combined
Number of views:
1000
产品参数
Parameters
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产品参数
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Friendly to environment, easy to operate Replace traditional wet cleaning Green environmental protection, low cost Zero emission pollution |
Ultra high frequency 13.56MHZ Ultra high frequency 13.56MHZ Plasma decontamination, surface activation High sealing vacuum chamber |
Can be customized Multi-layer cavity size, customizable Meet the requirements Multiple gas channels supporting expansion ports |
Product Parameter
■ Optional
| Model | PL20-MA | ||
| Power frequency | 40KHz/13.56MHz | Gas flow control | 0-500SCCM（MFC+-2%） |
| Capacity（L) | 60\110\150\180\200 | Gas channel | Two-way (Addable):Ar、N2，H2、CF4、O2 |
| Power (W) | 0-1000（Adjustable） | The layer number of processing |
11/15/17/17/21 |
| Cavity dimensions（WxDxH） | 400*450*400mm 500*450*500mm 500*500*600mm 500*600*600mm 500×580×700mm |
Overall dimensions（WxDxH） | 1000*1030*1630mm 1100*1030*1680mm 1200*1100*1730mm 1200*1200*1730mm 1250*1230*1790mm |
| Vacuum pump | (Oil pump/dry pump + Roots combination) | System control software | self-developed V2.0 |
| Vacuum degree | 5-100Pa（Adjustable） | Electrode ceramics | Imported high frequency ceramics |
| Cavity material | 316 stainless stee/imported aluminum alloy (Optional) | Cavity temperature | ＜30℃ |
| Plasma generator | 40KHz/13.56MHz（Optional） | Control mode | PLC + touch screen |
| Application field | Products are suitable for optoelectronics, IGBT, MEMS, COMS and other semiconductor packaging links; Plasma surface activation/cleaning, bonding after plasma treatment, plasma etching/activation, plasma degluing, plasma coating and plating (hydrophilic, hydrophobic), enhanced binding, plasma coating, plasma ashing and surface modification and other occasions; |
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Energy Intelligent Technology Wuxi Co.,Ltd
E-mail：market@eng-wx.com
Address: Building 8, Area C, Jinshan North Science and Technology Park, No.90 Huaian Road, Liangxi District, Wuxi City, Jiangsu Province, China
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