S17 (AOI) chip and lens sorting and inspection robot

S17 S17 S17

  Accurate chip recognition rate

Special lighting system
Suitable for a variety of specifications and material chips
Support the sorting of different Bins

MappingMapping intelligent retrieval

Chip inspection for defective products
Friendly user interface
 

Adapt to a variety of vehicles and materials

Gelpak, Wafer, frame
Waffle box, lens, To tube holder, PCB, etc.
 

 

Product Parameters

 

Optional


model
S17
S17Plus
S17Pro
Suction method
Rotary suction
Vertical suction
Vertical suction
Placement accuracy
X、Y≦±25um @3σ Chip Size  <5*5mm
X、Y≦±38um @3σ Chip Size  ≥5*5mm  
X、Y≦±25um @3σ Chip Size  <5*5mm
X、Y≦±38um @3σ Chip Size  ≥5*5mm
X、Y≦±25um @3σ /±15umChip Size  <5*5mm
X、Y≦±38um @3σ Chip Size  ≥5*5mm
Place θ
≤±3°
≤±2°/±1° ≤±2°/ ±1°/±0.5°
Wafer table (wafer)
MAX.8
MAX.12
MAX.12
Bond head θ range
NA 0-360° 0-360°
Z travel
8mm
60mm
60mm
Working desk size
MAX.130*220 mm
MAX.180*220mm
Wafer size affects this size
MAX.200*220mm
Wafer size affects this size
MAX.200*220mm
Wafer size affects this size
Chip size
0.2-16mm Compatible design thickness≥100um
0.2-16mm Compatible design thickness≥70um
0.2-16mm Compatible design thickness≥70um
Size, weigh
1100x 950 x 1650 mm
≈700Kg
1400*1100*1750 mm
≈1500Kg
1400*1660*2050 mm
≈1800Kg
Picking force control
Manual adjustment, spring force control                     
Controllable range:30~300g
Automatic voice coil control
Controllable range:20~300g
Automatic voice coil control
Controllable range:20~300g
Production capacity(UPH)
MAX.7000pcs/hr
Count according to the density of the fixture matrix
MAX.4000pcs/hr
Count according to the density of the fixture matrix
MAX.2600pcs/hr  /MAX.3000pcs/hr 
Count according to the density of the fixture matrix
Detection function
Chip dot recognition, chip defect similarity recognition
Chip dot recognition, chip defect similarity recognition
Chip dot recognition, chip defect similarity recognition
Health function
Deionization device, operating window light curtain 
Deionization device, operating window light curtain 
Deionization device, operating window light curtain 
Intelligent authority
Operator/engineer operation authority, Mapping map reading, generation (optional)
Operator/engineer operation authority, Mapping map reading, generation (optional)
Operator/engineer operation authority, Mapping map reading, generation (optional)
Optional combination
1.Wafer wafer table size: MAX. 8-inch wafer (Plastic ring or iron ring), 4-inch chip box, 2-inch chip box
2.Workbench compatible: 2 inch chip box, 4 inch chip box, MAX.6 inch iron ring, MAX.10 inch daughter and mother ring, custom fixture
3.Customizable AOI function
4.S17Pro optional flip 90-180 °; bottom recognition