M18 multi-chip module bonding robot

M18 M18 M18       

More accurate sub-pixel chip recognition rate

Simultaneous bonding of multiple specifications of chips\adapt to large\thin chips
Single\multiple thimble system、compatible with Wafer\Tray
Multi-vision system、chip front and back recognition

Healthier production control

Mapping classification\counting\intelligent retrieval
Chip inspection for defective products
User-friendly management software\wafer map library

 More flexible adaptation to products    

Module: IGBT\IPM\sensor\quick recovery\      
Rectifier\Thyristor\TO\SCR, etc.      
 

 

 

Product Parameters

 

 Optional


Model M18 M18 -TO M18 Pro M18 Max M18 NEAT
Placement accuracy ±38μm@3σ ±15 μm@3σ
±10 μm@3σ(Can be upgraded)
±38 μm@3σ
±25μm@3σ(Can be upgraded)
±38 μm@3σ
±25μm@3σ(Can be upgraded)
±38 μm@3σ
±25μm@3σ(Can be upgraded)
Placement angle ±3° ±1° ±3°/±2° ±3°/±2° ±3°/±2°
Wafer table (wafer) MAX.12 MAX.12 MAX.12 MAX.12 MAX.12
Chip size 0.8mm~8mm
8mm-30mm(Customized) thickness≥70um
0.2mm~5mm
5mm-10mm(Customized)thickness≥70um
1mm~15mm
15mm-30mm(Customized) thickness≥70um

02mm-20mm thickness≥70um 

2mm-20mm 
thickness≥70um
Size, weigh

≈1450*1000*1780 mm(Does not include automatic loading and unloading structure)
≈1800Kg(Excluding Wafer mechanism for automatic material change)

≈1450*1100*2200 mm(Does not include automatic loading and unloading structure)
≈1500Kg(Excluding Wafer mechanism for automatic material change)

≈1550*1990*1700 mm(Does not include automatic loading and unloading structure)
≈2000Kg(Excluding Wafer mechanism for automatic material change)
≈2010*1900*2050mm(Does not include automatic loading and unloading structure)
≈2000Kg(Excluding Wafer mechanism for automatic material change)
≈1780*1900*2050 mm(Does not include automatic loading and unloading structure)
≈1850Kg(Excluding Wafer mechanism for automatic material change)
Weld head function Dot, paint glue and welding head
( choose one from two)
Dot, paint glue and welding head
( choose one from two)
Double head Six heads (optional four heads + dispensing) Six heads
Picking force control Automatic voice coil control
Controllable range:20-50 g±5g/50-200g±10%
Automatic voice coil control
Controllable range:20-50 g±5g/50-200g±10%
Automatic voice coil control
Controllable range :20-50 g±5g/50-200g±10%
Automatic voice coil control
Controllable range:20-50 g±5g/50-200g±10%
Automatic voice coil control
Controllable range :20-50 g±5g/50-200g±10%
Function Auto loading and unloading
/Prefabricated Platform or Bottom 
Camera (optional)
Manual/Automatic loading and unloading Auto loading and unloading
/Prefabricated Platform or Bottom 
Camera (optional)
Auto loading and unloading/Caset/
Standard with four heads/Three cut/
One feeder
Auto loading and unloading/Caset/
Standard with four heads/Double cut/
One feeder
Worktable size  Waffle Tray : 2吋*12 
Gel Pak : 4 吋*4
Custom product box (Max. 300*200mm)
Waffle Tray : 2 *6  
Gel Pak : 4 *2
Custom product box (Max. 150*200mm)
Custom product box (Max. 220*220mm)
Adapt to the size of the material tray
Automatic adjustment of rail width
Manual adjustment of guide width
Blanking area:Length 500mm* width (150-330mm)
Length 470mm* Width (200-330mm) Length 470mm* Width (200-330mm)
Production capacity(UPH)

1500~2000 pcs/hr(Under standard conditions, 8-inch wafer;Chip size 0.8mm* 0.8mm;thickness≥100um)

1500~2000 pcs/hr(Under standard conditions, 8-inch wafer;Chip size 0.8mm* 0.8mm;thickness≥100um) 1500~2000 pcs/hr(Under standard conditions, 8-inch wafer;Chip size 0.8mm* 0.8mm;thickness≥100um) 1500~2000 pcs/hr(Under standard conditions, 8-inch wafer;Chip size 0.8mm* 0.8mm; thickness≥100um) 1500~2000 pcs/hr(Under standard conditions, 8-inch wafer;Chip size 0.8mm* 0.8mm;thickness≥100um)
Detection function Chip dot recognition, chip defect similarity recognition Chip dot recognition, chip defect similarity recognition Chip dot recognition, chip defect similarity recognition Chip dot recognition, chip defect similarity recognition Chip dot recognition, chip defect similarity recognition
Health function Deionization device, operating window light curtain (optional) Deionization device, operating window light curtain (optional) Deionization device, operating window light curtain (optional) Deionization device, operating window light curtain (optional) Deionization device, operating window light curtain (optional)
Intelligent authority Operator/engineer operation authority,
Mappingreading (optional)
Operator/engineer operation authority,
Mappingreading (optional)
Operator/engineer operation authority,
Mappingreading (optional)
Operator/engineer operation authority,
Mappingreading (optional)
Operator/engineer operation authority,
Mappingreading (optional)