huiyu
S17 (AOI) chip and lens sorting and inspection robot
S17 (AOI) chip and lens sorting and inspection robot
Controllable pickup and release force, chip 2D detection, MAP counting, classification, Wafer to Tray, Wafer to Wafer, automatic loading and unloading
M18 multi-chip module bonding robot
M18 multi-chip module bonding robot
Suitable for multi-chip bonding process MCM, dot, brush, and glue process; bond the solder pads, the bonding force is controllable, Max to DBC, Wafer to DBC, support multi-tip devices
T18 high-precision chip bonding robot
T18 high-precision chip bonding robot
The highest bonding accuracy is ±3 microns, the highest bonding angle is ±0.1°, the pick and bonding force is controllable, compatible with Tray&Wafer, tray & PCB automatic feeding and discharging device, and chip bottom vision device
EX20 high precision eutectic bonding robot
EX20 high precision eutectic bonding robot
The highest bonding accuracy is ±1.5 microns, the highest bonding angle is ±0.05°, reliable temperature rise and fall control, the temperature rise and fall rate can reach 100℃/s, compatible with multi-size Tary loading and unloading, chip bottom vision device
WB20 Ultrasonic Wire Bonding Machine
WB20 Ultrasonic Wire Bonding Machine
Ultra-precision micro-pitch wire bonding; high quality and consistency at the end of the wire; ultra-quiet workbench; high-precision ultrasonic generator; precise wire feeding system; high-speed bonding capability
A18 intelligent appearance inspection equipment
A18 intelligent appearance inspection equipment
The highest detection accuracy is 0.25μm; the highest detection capacity is 50 pieces; the false detection rate is less than 2%; the detection rate is less than or equal to 0.5%; the microscope level lens can be customized; the detection results are intelligently combined

Download      Consult

最小作战单元FMCU1300系列

全采QC-FMCU1300系列最小作战单元,专为前端应急指挥调度而生,机身采用一体化铝镁合金喷砂氧化工艺进行设计,便于随身携带,高度集成应急指挥调度、双向音视频通信、录像存储等功能,既能满足指挥部前移的指挥需求,也可与综合图像管理平台无缝对接,广泛应用于城市重大事件及地质性灾害事故的救援应急通信指挥。
Retail price
0.0
Market price
0.0
Number of views:
1000
Product serial number
Quantity
-
+
Stock:
Category
1
Number of views:
1000
产品参数
Parameters
产品特点
产品视频
产品参数

· 超薄笔记本设计,顶配8核心高性能CPU

· 15.6寸全高清三屏显示,支持独立显卡可选

· 内置6400mAH锂电池供电,续航时间2小时

· 全铝镁合金机身,CNC一体成型,喷砂氧化工艺

· 集成丰富的I/O扩展接口,具有良好的散热系统

· 便携式提手设计,支持随身携带进入前端指挥中心

· 支持灵活调取移动视频终端画面功能

· 支持基于GIS地图的指挥调度功能

· 支持与后端指挥中心进行联动指挥

We could not find any corresponding parameters, please add them to the properties table
Previous
Next