T18 high-precision chip bonding robot

T18 T18 T18

   More precise chip bonding

Sub-pixel chip recognition rate
Multi-function feeding\double soldering head mounting
Precise force control\laser height measurement
Support glue point\dipping\painting functions

Healthier production control

Compatible with MES interface\ESD protection
Mapping count\retrieve\classification
Chip inspection for defective products
Friendly user interface and more comprehensive smart wafer map library

More flexible adaptation to product switching

Substrate: TO\PCB\LF\deep cavity ceramics, etc.
Chip: LD\PD\TIA\resistance\filter\
Capacitance\ESD\Vcsel and other types
 

 

 

Product Parameter

 

 Optional


Model
T18
T18Plus
T18Pro
Placement accuracy
±15 μm@3σ
±7μm@3σ
±3μm@3σ
Placement angle
±1°
±0.5°
≤±0.1°
Wafer table (wafer)
MAX.8
MAX.8
MAX.8
Working desk size
L180mm*W(70-120mm)
Adapt to the size of the material tray (effective working stroke)
L180mm*W(70-120mm)
Adapt to the size of the material tray (effective working stroke)
L 205* W165mm
Adapt to the size of the material tray (effective working stroke)
Chip size
0.4mm~4mm
4mm-10mm(Customized)
thickness≥120um
0.2mm~5mm
5mm-10mm(Customized)
thickness≥100um
0.2mm~5mm
5mm-10mm(Customized)
thickness≥70um
Size, weigh
1400x 2450 x 2100 mm
≈2800Kg
Does not include loading and unloading
1400x 2450 x 2100 mm
≈2800Kg
Does not include loading and unloading
1400x 2450 x 2000 mm
≈2500Kg
Including magazine loading and unloading
Picking force control
Automatic voice coil control power
Controllable range:20-50 g±5g/50-200g±10%
Automatic voice coil control power
Controllable range:20-50 g±5g/50-200g±10%
Automatic voice coil control power
Controllable range:20-50 g±5g/50-200g±10%
Production capacity(UPH)
MAX.1200pcs/hr
Under standard conditions, 8 inch wafer; Chip size 0.8mmX 0.8mm; thickness≥100um)
MAX.1000pcs/hr
Under standard conditions, 8 inch wafer; Chip size 0.8mmX 0.8mm; thickness≥100um)
MAX.800pcs/hr
It depends on the feeding method, chip size and product mounting process
Detection function
Chip dot recognition, chip defect similarity recognition
Chip dot recognition, chip defect similarity recognition
Chip dot recognition, chip defect similarity recognition
Health function
Deionization device, operating window light curtain
Deionization device, operating window
light curtain
Deionization device, operating window
light curtain 
Intelligent authority
Operator/engineer operation authority,
Mapping map reading, generation (optional)
Operator/engineer operation authority,
Mapping map reading, generation (optional)
Operator/engineer operation authority,
Mapping map reading, generation (optional)
Optional combination: 
1.Wafer table size: MAX. 8 inch wafer (Plastic ring or iron ring), 4 inch chip box, 2 inch chip box
2.Tray compatible: 2 inch chip box, 4 inch chip box, custom fixture
3.Automatic loading and unloading size: total width up and down: 1100mm