EX20 high precision eutectic bonding robot

EX20 EX20 EX20

Maximum bonding accuracy ±1.5um

More precise chip bonding
Sub-pixel chip recognition rate
Multi-function feeding, dual soldering head bonding
Precise force control\height measurement

Reliable temperature rise control

Healthier production control, compatible with MES interface\ESD protection
Mapping count\retrieve\classification
Chip inspection for defective products
User-friendly interface\Comprehensive wafer map library

More flexible adaptation to product switching

Suitable for: 5G communication chip COC\high power laser chip\
laser and other chips eutectic die bonding
Military industry: metal shell multi-chip eutectic die bonding
Gold-tin bonding of gallium arsenide and gallium nitride die

 

 

Product Parameter

 

 Optional


Model EX20 EX20 Plus EX20 Pro
Placement accuracy ±5μm@3σ ±3μm@3σ ±3μm@3σ
Angle ≤0.1° ≤0.05° ≤0.05°
Wafer table (wafer) 6 inch wafer 6 inch wafer 6 inch wafer
Working desk size
Adapt to the size of the material tray (effective working stroke)
Tray loading
120*120(4*2 inch)
Tray loading
120*120(4*2 inch)
Tray loading
120*120(4*2 inch)
Chip size 0.15~5mm 0.15~5mm 0.15~5mm
Size, weigh 1700*1400*2100
2500KG
1700*1400*2100
2500KG
1700*1400*2100
2500KG
Picking force control Automatic voice coil control
Controllable range:10~300g
Automatic voice coil control
Controllable range:10~300g
Automatic voice coil control
Controllable range:10~300g
Eutectic bonding Programmable ramp rates up to 450ºC Programmable ramp rates up to 450ºC Programmable ramp rates up to 450ºC
Detection function Chip dot recognition, chip defect similarity recognition Chip dot recognition, chip defect similarity recognition Chip dot recognition, chip defect similarity recognition
Health function Deionization device, operating window light curtain  Deionization device, operating window light curtain  Deionization device, operating window light curtain 
Intelligent authority Operator/engineer operation authority, Mipping map reading, generation (optional) Operator/engineer operation authority, Mipping map reading, generation (optional) Operator/engineer operation authority, Mipping map reading, generation (optional)
Optional combination: :1、Wafer  loading   2、Tray loading   3、Automatic replacement of suction nozzle