WB20 Ultrasonic Wire Bonding Machine

   Large travel effective working area

Multi-chip multi-wire bonding
Compatible with multi-standard wire diameter bonding
Customizable large-stroke effective bonding area

Bond disconnection detection alarm

General application of fine aluminum wire bonding field
Adapt to a variety of products and vehicles
Flexible customization

High image number visual flight shooting function

Gigabit high-speed industrial camera
Material before bonding
Bad recognition alarm

 

 

Product Parameter

 

 Optional


Model WB20 WB20 Pro
Bonding Precision Max :XY≤±0.5μm Max :XY≤±0.1μm
Bonding Angle Max :45° Max : 90°
Working desk size XY effective stroke: 100*100mm
Angle of θ:360°
Welding Z:Max 3mm
XY effective stroke:150*150mm
Angle of θ:360°
Welding Z:Max 10mm
Bonding Power 0-2 watts (numerically adjustable) 0-2 watts (numerically adjustable)
Capacity Max.15000 wires/hr
(Calculated according to the number of product lead bonding lines and fixture matrix density)
Max.12000 wires/hr
(Calculated according to the number of product lead bonding lines and fixture matrix density)
Size, weigh 915*765*1380
≈260KG
1000*800*1500
≈600KG
Bonding Pressure
Control
Automatic voice coil control
Controllable range:15~200g
Automatic voice coil control
Controllable range:15~200g
Bonding Wire Diameter 17.5-50 μm 17.5-50 μm
Minimum weld spot
size/spacing
63μm*80μm/68μm 63μm*80μm/68μm
Up-down material Manual fixture type Cartridge type
Vacuum connection <-0.8bar(Fixture vacuum)
Transducer frequency 60-142kHZ
Force 10-400 cN
Health function Electrostatic ion removal device
Intelligent authority Operator/engineer operation authority
Process Capability 1、Bonding force≥9g(Wire diameter1.5mil)
2、Solder joint thrust≥30g(Wire diameter1.5mil)