huiyu
imgboxbg

More flexible, more stable, more precise

Chip bonding and testing equipment 

T18 high-precision chip bonding robot

The highest bonding accuracy is ±3 microns, the highest bonding angle is ±0.1°, the pick and bonding force is controllable, compatible with Tray&Wafer, tray & PCB automatic feeding and discharging device, and chip bottom vision device
了解更多 ⇀
上一页
1