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More flexible, more stable, more precise

Chip bonding and testing equipment 

EX20 high precision eutectic bonding robot

The highest bonding accuracy is ±1.5 microns, the highest bonding angle is ±0.05°, reliable temperature rise and fall control, the temperature rise and fall rate can reach 100℃/s, compatible with multi-size Tary loading and unloading, chip bottom vision device
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