huiyu
S17 (AOI) chip and lens sorting and inspection robot
S17 (AOI) chip and lens sorting and inspection robot
Controllable pickup and release force, chip 2D detection, MAP counting, classification, Wafer to Tray, Wafer to Wafer, automatic loading and unloading
M18 multi-chip module bonding robot
M18 multi-chip module bonding robot
Suitable for multi-chip bonding process MCM, dot, brush, and glue process; bond the solder pads, the bonding force is controllable, Max to DBC, Wafer to DBC, support multi-tip devices
T18 high-precision chip bonding robot
T18 high-precision chip bonding robot
The highest bonding accuracy is ±3 microns, the highest bonding angle is ±0.1°, the pick and bonding force is controllable, compatible with Tray&Wafer, tray & PCB automatic feeding and discharging device, and chip bottom vision device
EX20 high precision eutectic bonding robot
EX20 high precision eutectic bonding robot
The highest bonding accuracy is ±1.5 microns, the highest bonding angle is ±0.05°, reliable temperature rise and fall control, the temperature rise and fall rate can reach 100℃/s, compatible with multi-size Tary loading and unloading, chip bottom vision device
WB20 Ultrasonic Wire Bonding Machine
WB20 Ultrasonic Wire Bonding Machine
Ultra-precision micro-pitch wire bonding; high quality and consistency at the end of the wire; ultra-quiet workbench; high-precision ultrasonic generator; precise wire feeding system; high-speed bonding capability
A18 intelligent appearance inspection equipment
A18 intelligent appearance inspection equipment
The highest detection accuracy is 0.25μm; the highest detection capacity is 50 pieces; the false detection rate is less than 2%; the detection rate is less than or equal to 0.5%; the microscope level lens can be customized; the detection results are intelligently combined

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T18 high-precision chip bonding robot

The highest bonding accuracy is ±3 microns, the highest bonding angle is ±0.1°, the pick and bonding force is controllable, compatible with Tray&Wafer, tray & PCB automatic feeding and discharging device, and chip bottom vision device
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T18 T18 T18

   More precise chip bonding

Sub-pixel chip recognition rate
Multi-function feeding\double soldering head mounting
Precise force control\laser height measurement
Support glue point\dipping\painting functions

Healthier production control

Compatible with MES interface\ESD protection
Mapping count\retrieve\classification
Chip inspection for defective products
Friendly user interface and more comprehensive smart wafer map library

More flexible adaptation to product switching

Substrate: TO\PCB\LF\deep cavity ceramics, etc.
Chip: LD\PD\TIA\resistance\filter\
Capacitance\ESD\Vcsel and other types
 

 

 

Product Parameter

 

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Model
T18
T18Plus
T18Pro
Placement accuracy
±10μm@3σ
±7μm@3σ
±3μm@3σ
Placement angle
±1°
±0.5°
±0.1°
Wafer table (wafer)
MAX.8吋
MAX.8吋
MAX.8吋
Working desk size
MAX:120*180mm
Adapt to the size of the material tray (effective working stroke)
MAX:120*180mm
Adapt to the size of the material tray (effective working stroke)
MAX:120*180mm
Adapt to the size of the material tray (effective working stroke)
Chip size
0.25mm~8mm thickness≥120um
0.18mm~16mm  thickness≥70um
0.18mm~16mm  thickness≥70um
Size, weigh
1600x1300 x 1950 mm
≈2800Kg
Does not include loading and unloading
1600x1300 x 1950 mm
≈2800Kg
Does not include loading and unloading
1600x1300 x 1950 mm
≈2800Kg
Does not include loading and unloading
Picking force control
Automatic voice coil control
Controllable range:20~300g
Automatic voice coil control
Controllable range:20~300g
Automatic voice coil control
Controllable range:20~300g
Production capacity(UPH)
MAX.1600pcs/hr
Count according to the density of the fixture matrix
MAX.1300pcs/hr
Count according to the density of the fixture matrix
MAX.1000pcs/hr
Count according to the density of the fixture matrix
Detection function
Chip dot recognition, chip defect similarity recognition
Chip dot recognition, chip defect similarity recognition
Chip dot recognition, chip defect similarity recognition
Health function
Deionization device, operating window light curtain
Deionization device, operating window
light curtain
Deionization device, operating window
light curtain 
Intelligent authority
Operator/engineer operation authority,
Mapping map reading, generation (optional)
Operator/engineer operation authority,
Mapping map reading, generation (optional)
Operator/engineer operation authority,
Mapping map reading, generation (optional)
Optional combination: 
1.Wafer  table size: MAX. 8-inch wafer (Plastic ring or iron ring), 4-inch chip box, 2-inch chip box
2.Workbench compatible: 2 inch chip box, 4 inch chip box, MAX.6 inch iron ring, MAX.10 inch daughter and mother ring, custom fixture
3.Automatic loading and unloading size: total width up and down: 1000mm
4.Customizable AOI function

 

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