huiyu
S17 (AOI) chip and lens sorting and inspection robot
S17 (AOI) chip and lens sorting and inspection robot
Controllable pickup and release force, chip 2D detection, MAP counting, classification, Wafer to Tray, Wafer to Wafer, automatic loading and unloading
M18 multi-chip module bonding robot
M18 multi-chip module bonding robot
Suitable for multi-chip bonding process MCM, dot, brush, and glue process; bond the solder pads, the bonding force is controllable, Max to DBC, Wafer to DBC, support multi-tip devices
T18 high-precision chip bonding robot
T18 high-precision chip bonding robot
The highest bonding accuracy is ±3 microns, the highest bonding angle is ±0.1°, the pick and bonding force is controllable, compatible with Tray&Wafer, tray & PCB automatic feeding and discharging device, and chip bottom vision device
EX20 high precision eutectic bonding robot
EX20 high precision eutectic bonding robot
The highest bonding accuracy is ±1.5 microns, the highest bonding angle is ±0.05°, reliable temperature rise and fall control, the temperature rise and fall rate can reach 100℃/s, compatible with multi-size Tary loading and unloading, chip bottom vision device
WB20 Ultrasonic Wire Bonding Machine
WB20 Ultrasonic Wire Bonding Machine
Ultra-precision micro-pitch wire bonding; high quality and consistency at the end of the wire; ultra-quiet workbench; high-precision ultrasonic generator; precise wire feeding system; high-speed bonding capability
A18 intelligent appearance inspection equipment
A18 intelligent appearance inspection equipment
The highest detection accuracy is 0.25μm; the highest detection capacity is 50 pieces; the false detection rate is less than 2%; the detection rate is less than or equal to 0.5%; the microscope level lens can be customized; the detection results are intelligently combined

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M18 multi-chip module bonding robot

Suitable for multi-chip bonding process MCM, dot, brush, and glue process; bond the solder pads, the bonding force is controllable, Max to DBC, Wafer to DBC, support multi-tip devices
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M18 M18 M18       

More accurate sub-pixel chip recognition rate

Simultaneous bonding of multiple specifications of chips\adapt to large\thin chips
Single\multiple thimble system、compatible with Wafer\Tray
Multi-vision system、chip front and back recognition

Healthier production control

Mapping classification\counting\intelligent retrieval
Chip inspection for defective products
User-friendly management software\wafer map library

 More flexible adaptation to products    

Module: IGBT\IPM\sensor\quick recovery\      
Rectifier\Thyristor\TO\SCR, etc.      
 

 

 

Product Parameters

 

 Optional


Model M18  M18 Plus M18 Pro M18 Max
Placement accuracy ±15μm@3σ ±25μm@3σ ±10μm@3σ ±38μm@3σ
Placement angle ±1.5° ±2° ±1° ±3°
Wafer table (wafer) MAX.8 MAX.8 MAX.8 MAX.12
Chip size, 0.18mm~16mm   thickness≥70um 0.18mm~16mm;
thickness≥70um
0.18mm~16mm;
thickness≥70um
0.18mm~16mm;
thickness≥70um
Size, weigh ≈1300x 1650 x 1800 mm
≈2000Kg
≈1300x 1650 x 1800 mm
≈2000Kg
(Excluding Wafer mechanism for automatic material change)
≈1300x 1650 x 1800 mm
≈2000Kg
(Excluding Wafer mechanism for automatic material change)
≈1700x 1050 x 2200 mm
≈2000Kg
(Excluding Wafer mechanism for automatic material change)
Weld head function Dot glue, double suction head Dot glue, double suction head Dot glue, double suction head Dot glue, double suction head
Picking force control Automatic voice coil control
Controllable range:10~300g
Automatic voice coil control
Controllable range:20~300g
Automatic voice coil control
Controllable range :10~300g
Automatic voice coil control
Controllable range:20~300g
Loading and unloading function Manual loading and unloading Independent loading and unloading mechanism / track connection(950mm) Independent loading and unloading mechanism / track connection(950mm) Auto loading and unloading/Caset/Standard with four heads/Double cut/Two feeders
Worktable width
Track
MAX.500*350mm
Adapt to the size of the material tray
MAX.500*350mm
Adapt to the size of the material tray
MAX.500*350mm
Adapt to the size of the material tray
MAX.500*350mm
Adapt to the size of the material tray
Production capacity(UPH)

MAX.2000Kpcs/hr 

Count according to the density of the fixture matrix

MAX.2000Kpcs/hr 

Count according to the density of the fixture matrix

MAX.2000Kpcs/hr 

Count according to the density of the fixture matrix

MAX.3000Kpcs/hr 

Count according to the density of the fixture matrix

Detection function Chip dot recognition, chip defect similarity recognition Chip dot recognition, chip defect similarity recognition Chip dot recognition, chip defect similarity recognition Chip dot recognition, chip defect similarity recognition
Health function Deionization device, operating window light curtain (optional) Deionization device, operating window light curtain (optional) Deionization device, operating window light curtain (optional) Deionization device, operating window light curtain (optional)
Intelligent authority Operator/engineer operation authority,
Mappingreading (optional)
Operator/engineer operation authority,
Mappingreading (optional)
Operator/engineer operation authority,
Mappingreading (optional)
Operator/engineer operation authority,
Mappingreading (optional)
Optional combination:  1.Wafer wafer table size: MAX.8 inch wafer (Plastic ring or iron ring)
2.Workbench size: 4 inch chip box, 2 inch chip box, custom fixture
3.CASET, bottom recognition
4.Automatic loading and unloading mechanism: according to material tray 350 * 500, single mechanism size: 700 * 900mm, weight: 300KG
5.Automatic Wafer mechanism change: press 8 inch wafer iron ring, size: 350 * 350mm, weight: 50KG

 

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