Value for customers

Provide you with more flexible, more stable, more accurate and better cost-effective intelligent equipment

To ensure the success of your project for you

To ensure the success of your project for you

Master advanced packaging and testing process Have a complete service docking process Provide products with excellent performance
Value for customers

To reduce labor cost for you

Provide higher chip bonding accuracy Faster chip bonding speed Higher equipment utilization rate
To provide "flexible customization"

To provide "flexible customization"

In-depth understanding of industry customer focused value R&D capability based on process requirements Fast equipment delivery capability

Semiconductor packaging solution specialist

More Flexible · More Stable · More Accurate

News



2025-08-14

Chipmakers Ramp Up Deployment in Battle for Advanced Packaging

Advanced packaging puts equipment performance and technological sophistication to a more demanding test

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2025-04-25

INVITATION丨PCIM Europe 2025

NVITATION丨PCIM Europe Exhibition and Conference 2025

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