Value for customers

Provide you with more flexible, more stable, more accurate and better cost-effective intelligent equipment


To ensure the success of your project for you

Master advanced packaging and testing process

Have a complete service docking process

Provide products with excellent performance


To reduce labor cost for you: 

Provide higher chip bonding accuracy

Faster chip bonding speed

Higher equipment utilization rate


To provide "flexible customization"

In-depth understanding of industry customer focused value

R&D capability based on process requirements

Fast equipment delivery capability

Our advantages


Advanced management, technological innovation, providing high quality and high efficiency packaging solutions


Authoritative and efficient R&D team

With a team of experts from Tsinghua University, Nanjing University and other well-known institutions

A technical team with more than 16 years of experience in semiconductor equipment research and development

After-sales team with more than 15 years of experience in semiconductor equipment service


unique core technologies

Innovative equipment operating system, the whole process of Chinese secondary menu control

Independent research and development of drive control, optical and machine vision core technologies

With nearly 100 invention patents.


Trustworthy operational strength

With more than 17 years of excellent operating managers in the semiconductor equipment industry

With a complete business process system from sales, R&D to final service training

With sales and after-sales service centers in Wuxi, Shenzhen, Chengdu and Wuhan

Semiconductor packaging solution specialist

More Flexible  ·  More Stable  ·  More Accurate